Suzhou Lapple Technology Co., Ltd. is a professional provider of process solutions for the semiconductor industry.

The solution includes: temporary wafer bonding and debonding, precision lapping and polishing of wafers/end faces, double-sided lapping and polishing of wafers, wafer scriber and breaker, LD bar stacking and unstacking, ultra-thin and fragile wafer processing, wafer thickness and film thickness measurement, wire bonding machine, die bonder machine, etc. As a professional provider, we provide customers with world-class and high-quality equipments, consumables, and process technology services in related application fields.

We have our own laboratory, factory, and technical personnel who can provide services such as equipment demonstration, precision lapping and polishing process development, equipment design and manufacturing, and customer sample testing.

Our products and technologies are widely used in various industries such as optoelectronics, semiconductors, precision ceramics, and precision optics.

We are committed to becoming a focused, humanized, and growth oriented technology enterprise. Our dynamic and efficient professional team provides customers with professional and meticulous services in all aspects.