High Precision Lapping and Polishing Equipments
Discover our innovative solutions for the semiconductor industry
Optimize your bonding process with our cutting-edge technology that ensures superior flatness and no bubble bonding for semiconductor wafers and components.
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Optimize your lapping process with our cutting-edge technology that ensures superior flatness and surface quality for semiconductor wafers and components.
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Achieve nanometer-level surface finishes with our advanced polishing systems designed for high-precision semiconductor manufacturing requirements.
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For hard materials polishing,such as Sapphire,SiC,Diamond,to get a very good surface finish,less than 3nm/sub-nm surface roughness.
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Lapping and polishing III-V materials,such as GaAs,GaSb,InP,MCT,CZT,InSb...
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For applications requiring the highest level of precision, our ultra-precision polishing solutions deliver unparalleled surface quality and accuracy for InP wafers.
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For applications requiring the highest level of precision, our ultra-precision polishing solutions deliver unparalleled surface quality and accuracy for GaSb wafers.
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For applications requiring the highest level of precision, our ultra-precision polishing solutions deliver unparalleled surface quality and accuracy for Silicon wafers.
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For the highest level of precision, LiNO3 endface,Optics endface,fibre endface and chips endface,with angle and special fixtures.
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For the highest level of precision, Copper,Nickel Alloy,Molybdenum,Titanium Alloy,Tungsten Steel,Hard-disk,...
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For the highest level of precision,PIG(phosphor in glass) wafers.
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