Advanced Lapping and Polishing Solutions for Semiconductor Industry
Our advanced lapping and polishing solutions deliver unparalleled surface quality and dimensional accuracy for ultra-thin fragile LiNbO3 wafers. With micron-level precision control and industry-leading process stability, we help manufacturers achieve higher yields and superior product performance.
Lapple Technology's solutions combine cutting-edge hardware with intelligent software control to deliver consistent, high-quality surface results. Our proprietary process optimize material removal rates while minimizing subsurface damage.
With near 20 years of industry experience, our solutions have been adopted by leading semiconductor manufacturers for applications ranging from silicon wafer preparation to advanced packaging and MEMS fabrication.
The solution features real-time monitoring and adaptive control capabilities that adjust process parameters to maintain optimal performance, ensuring consistent results batch after batch.
Lapple Lapping and polishing Machine ，precision lapping and polishing for LiNbO3 wafers
Achieve Surface Roughness down to Sub-nano and TTV down to 3um with our advanced process control algorithms.
Faster processing times compared to conventional methods while maintaining superior surface quality and uniformity.
Intelligent process monitoring and adaptive control ensure consistent results with minimal operator intervention.
Complete lapping solution for ultra-thin and fragile wafer processing.
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Contact our team to discuss how our precision lapping and polishing solutions can enhance your production quality and efficiency.
