Lapple Technology

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+86512-52887570

Suzhou Lapple Technology Co.,Ltd

High Precision Lapping and Polishing Equipments

Wafer Bonder-Main Products

Discover our range of high-precision equipment designed for the semiconductor industry

Wafer Bonder
WB100 Manual Wafer Bonder

Wafer Bonder WB100

Manual Wafer bonder for semiconductor wafer bonding

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Wafer bonders
WB061 Wafer Bonder

Wafer Bonder WB061

Semi-auto Wafer bonder for semiconductor wafer bonding

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Wafer Bonder
Multi Heads Wafer Bonder

Wafer Bonder MHWB

Multi Stations,Semi-auto Wafer bonder for semiconductor wafer bonding

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Wafer Bonder
Spin Coater

Spin Coater

For liquid wax and wafer temporary bonding.

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Wafer Bonder
HP081 Programmable Hot Plate

HP081 Programmable Hot Plate

For wax coating and wafer bake.Wafer size up to 8"

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Wafer Bonder
Wafer Debonder

Wafer Debonder

For wafer temporary debonding.

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Wafer Bonder
Glass Substrates

Glass Substrates

For wafer bonding.High quality and flatness

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Wafer Bonder
Sapphire Carrier

Sapphire Carrier

For wafer temporary bonding.Size up to 12".High quality and flatness

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Wafer Bonder
Bonding Wax

Bonding Wax

For wafer temporary bonding.High quality.

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