High Precision Lapping and Polishing Equipments
Sapphire Carrier,for temporary bonding, Specially designed for temporary fixation of semiconductor materials such as GaAs, InP, Si, etc., supporting customized drilling needs. Featuring high transparency, high flatness, and excellent wear resistance, it supports repeated use and is economically efficient. Sapphire material has a hardness second only to diamond, and has excellent durability, chemical corrosion resistance, and scratch resistance. Its excellent thermal conductivity makes it an ideal choice for precision machining of semiconductor materials such as GaAs, InP, Si, etc.
112mm,160mm,200mm,315mm,can be customized according to your requirements.
0.5mm~5mm,can be customized according to your requirements.
Double-sided lapped,very good TTV,high temperature resistant
Sapphire
| Substrate Size | Up to 8inch in diameter |
|---|---|
| Thickness | 0.5mm~2mm |
| TTV | 2um,4um,6um,8um,10um,15um for different diameters |
| Temperature | Can be used at high temperature. |
| Chemical resistant | Resistance to chemical corrosion and scratching |
| Materials | Sapphire |
Multi Stations,Semi-auto Wafer bonder for semiconductor wafer bonding
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