High Precision Lapping and Polishing Equipments
MHWB is a modular semi-auto wafer bonder with multi heads,you can order 1 to 6 heads according to your production. It has functions such as timing, vacuum,pressurization, heating,cooling etc. For wafer temporay bonding.Wafer size up to 6" wafers , 8" version can be customized. Max Temperature up to 200degree,and Pressure 0~3bar,adjustable. This wafer bonder MHWB is our bonding solution designed for advanced semiconductor manufacturing. It offers micrometer-level precision for wafer-to substrate bonding applications,especially for GaN,SiC,Diamond,Ceramic,GaAs,InP,InSb, etc. With its innovative bonding capabilities, it ensures exceptional bond strength and excellent accuracy for your materials and your production.
Touch Screen.It has 5 processes for different bonding applications.
After bonding the wax layer thickness very uniform,no bubble
Temperature uniformity across wafer
A Reliable Airbag Bonding
| Wafer Size | Up to 150mm in diameter,large size 200mm is customizable |
|---|---|
| Functions | timing, pressurization, heating(included),vacuum(included),cooling(included) |
| Bond Pressure | 0~3bar (adjustable) |
| Temperature Range | Room Temp to 200°C |
| Throughput | Depends on the process |
| Chamber Environment | Vacuum Pump included |
| Power Requirements | 220V, 10A for each head |
