Wafer Bonder

Model: WB061

WB061 is a desktop semi-auto wafer bonder, very compact and convenient. It has functions such as timing, vacuum,pressurization, heating,cooling etc. For wafer temporay bonding.Wafer size up to 6" wafers , 8" version can be customized. Max Temperature up to 200degree,and Pressure 0~3bar,adjustable. This wafer bonder WB061 is our bonding solution designed for advanced semiconductor manufacturing. It offers micrometer-level precision for wafer-to substrate bonding applications,especially for GaN,SiC,Diamond,Ceramic,GaAs,InP,InSb, etc. With its innovative bonding capabilities, it ensures exceptional bond strength and good accuracy for your materials.

Easy Operation

Touch Screen.It has 5 processes for different bonding applications.

High Precision

After bonding the wax layer thickness very uniform,no bubble

Advanced Thermal Control

Temperature uniformity across wafer

Airbag Bonding

A Reliable Airbag Bonding

Technical Specifications

Wafer Size	Up to 150mm in diameter,large size 200mm and 300mm are customizable
Functions	timing, pressurization, heating(included),vacuum(included),cooling(included)
Bond Pressure	0~3bar (adjustable)
Temperature Range	Room Temp to 200°C
Throughput	Depends on the process
Chamber Environment	Vacuum Pump included
Power Requirements	220V, 10A