High Precision Lapping and Polishing Equipments
The Lapple LP-Mount series liquid wax is engineered for high-performance temporary bonding of semiconductor wafers, particularly electro-optic and optical materials. This liquid thermoplastic adhesive offers exceptional shear strength for secure handling during demanding processing steps. This combination makes it especially valuable for applications requiring robust temporary mounting and reliable de-bonding.
Offer precise softening/melting points and tailored viscosity during application, ensuring uniform, void-free bonding critical for subsequent thinning steps.
Provide exceptional temporary bond strength at processing temperatures, securely holding wafers during high-stress steps like grinding/lapping/polishing.
Engineered to debond cleanly, leaving minimal residue on the delicate device wafer surface, reducing the need for aggressive and potentially damaging cleaning steps..
High-quality grades are formulated for low outgassing under vacuum and thermal cycling, minimizing contamination risks in sensitive semiconductor processes.
| Name | Type | Soften/Flow Point °C | Purpose | Pack Size | Description |
|---|---|---|---|---|---|
| LCON-WA500 | Liquid wax | Softening at 110°C,Flow at 117°C | Temporary Bonding | 1L Bottle | Suitable for bonding a wide range of semiconductor wafers. |
| LCON-WA502 | Liquid wax | Softening at 155°C,Flow at 168°C | Temporary Bonding | 1L Bottle | Suitable for bonding a wide range of semiconductor wafers. |
| LCON-WA506 | Liquid wax | Softening at 42°C,Flow at 48°C | Temporary Bonding | 2L Bottle | Suitable for bonding a wide range of semiconductor wafers. |
For III-V materials,InP and GaAs wafers and chips precision polishing.
View Details
Differents pad and cloth for polishing different materials and process.
View Details
