Lapping & Polishing Machine - Suzhou Lapple Technology

Solid Wax

Series:LP-Mount series,for temporary bonding and debonding.

The Lapple LP-Mount series are engineered for high-performance temporary bonding of semiconductor wafers,for lapping, polishing and grinding applications primarily in the semiconductor industry.

These unique adhesive products are available in both solid and liquid form and provide ultra-low viscosity and high bonding strength. The physical properties of the wax allows for precisely controlled process rates at high speeds. The water soluble liquid wax is specifically designed for easily demounting delicate, thin device semiconductor wafers using water. The solid waxes are removed using Waxclear detergents.

Controlled Rheology:

Offer precise softening/melting points and tailored viscosity during application, ensuring uniform, void-free bonding critical for subsequent thinning steps.

High Shear Strength (When Required):

Provide exceptional temporary bond strength at processing temperatures, securely holding wafers during high-stress steps like grinding/lapping/polishing.

Clean Release & Low Residue:

Engineered to debond cleanly, leaving minimal residue on the delicate device wafer surface, reducing the need for aggressive and potentially damaging cleaning steps..

Low Outgassing & High Purity:

High-quality grades are formulated for low outgassing under vacuum and thermal cycling, minimizing contamination risks in sensitive semiconductor processes.

Bonding Media/Wax:Solid

Name	Type	Melting Point °C	Purpose	Pack Size	Description
GP324	Solid,Amber Blue	soften point 70°C	Temporary Bonding	100g stick	Suitable for bonding semiconductor wafers where high shear strength is required. softening at 70 °C, fluid at 122 °C.
PW199	Solid,Pellet White	58~59°C	Temporary Bonding	500g	General boding wax,suitable for bonding a wide range of semiconductor wafers
QW200	Solid,Dark Yellow	70°C	Temporary Bonding	450g	Suitable for bonding a wide range of semiconductor wafers.
FW110L	Solid,light Yellow	55°C	Temporary Bonding	80g Stick	Suitable for bonding a wide range of semiconductor wafers.
SW267	Solid,light Yellow	68°C	Temporary Bonding	100g Stick	Suitable for bonding a wide range of semiconductor wafers.
AW180	Hot water removal,Solid	50°C	Temporary Bonding	100g Stick	Suitable for bonding a wide range of semiconductor wafers.
Waxclear 178	Wax Remover,Citrus	set at 80~100°C	Temporary Debonding	5L Bottle	Non-solvent cleaning fluid. Suitable for cleaning and debonding a wide range of semiconductor wafers.
Waxclear 179	Wax Remover,Hydrocarbon	set at 80~100°C	Temporary Debonding	5L Bottle	Hydrocarbon cleaning fluid. Suitable for cleaning and debonding a wide range of semiconductor wafers.