Lapping and Polishing Product - Suzhou Lapple Technology

Lapping and Polishing Powders

For wafer and chips precision lapping and polishing.

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Polishing Slurry

For wafer and chips precision polishing.

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Chemical Polishing Slurry

For III-V materials,InP and GaAs wafers and chips precision polishing.

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Polishing Pad/Polishing Cloth

Differents pad and cloth for polishing different materials and process.

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WAX324 Bonding Solid Wax

For wafer temporary bonding.

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Liquid Bonding Wax

For wafer temporary bonding.

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Wax Remover

For wafer debonding.

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Suzhou Lapple Technology Co.,Ltd