Lapping & Polishing Machine - Suzhou Lapple Technology

Chemical Polishing Slurries,High PH.

Series:Chemical Polishing Slurry for III-V materials,IR materials, GaAs,InP,MCT,CZT,InSb..

Lapple Chempo Slurry is a high-performance, Sodium hypochlorite based polishing fluid, with a high pH. This unique composition delivers exceptional advantages for chemo-mechanical polishing III-V semiconductor materials,such as GaAs,InP,MCT,CZT,InSb....

Superior Results: Achieve the highest quality surface finish with significantly finer results.

Enhanced Efficiency: Deliver faster material removal rates for increased productivity.

Unmatched Consistency: Maintain stable performance and retain cutting properties consistently throughout the entire preparation process.

Reliable Operation: Offer excellent material removal capability while resisting settling and clogging of dosing systems.

Optimized Material Removal & Finish

Offers an exceptional balance between high material removal rate (MRR) and the ability to achieve ultra-smooth, defect-free surface finishes critical for advanced materials.

Minimized Sub-Surface Damage

Engineered chemistry minimizes surface and sub-surface damage (like scratches, dislocations, or roughness), preserving wafer integrity and device performance.

Stable Colloidal Performance

Maintains consistent particle dispersion stability (zeta potential) throughout the polishing process, preventing aggregation and minimizing defectivity for higher yields.

Enhanced Cost Efficiency

Provides an optimal balance of high performance, extended slurry life, and reduced dilution requirements, leading to lower overall cost of ownership (CoO)。