Lapping & Polishing Machine - Suzhou Lapple Technology

Waxclear/Wax Remover

Series:Waxclear series,for wafer debonding.

The Lapple Waxclear series are engineered for high-performance temporary debonding of semiconductor wafers from substrates.

Waxclear 178 is an non-toxic, non-flammable, biodegradable and effective solvent and degreaser. It is specifically formulated for removing waxes , pitches, flux, grease, resin, and solvent-soluble resists from sensitive optical and electronic components (glass, ceramic, metal), including demounting ultra-thin semiconductor wafers.

Waxclear 179 is a non-flammable, odorless degreaser that removes light oil from optics and electronics components. It can also be used to remove wax and pitch; although the necessary soaking time is longer than that required for the Waxclear 178. It has a higher flash point and evaporates more slowly than Waxclear 178.

Natural&Safe:

Naturally occurring, non-toxic, non-flammable, biodegradable, non-ozone depleting.

High Performance & Neutral pH:

High solvency power; quickly removes target materials; virtually eliminates residual films; increases product throughput.

Miscibility:

Miscible in all proportions with acetone, ethanol, and isopropanol (used for post-wash rinsing).

Usage

Used undiluted, typically heated to 80~100°C for effective wax removal. Requires a final rinse with alcohol or acetone due to its oily consistency. Can also be used at room temperature with longer soak times or as a spray for lighter cleaning.

Debonding Wax Remover

Name	Type	Wax Debonding Point °C	Purpose	Pack Size	Description
Waxclear 178	Wax Remover,Orange Odour	set at 80~100°C	Temporary Debonding	5L Bottle	Non-solvent cleaning fluid. Suitable for cleaning and debonding a wide range of semiconductor wafers.
Waxclear 179	Wax Remover,Hydrocarbon	set at 80~100°C	Temporary Debonding	5L Bottle	Hydrocarbon cleaning fluid. Suitable for cleaning and debonding a wide range of semiconductor wafers.