Wafer Bonder

Model: WB100

WB100 is a desktop manual wafer bonder, very compact and convenient. It has functions such as timing, pressurization, heating,cooling etc. For wafer temporay bonding.Wafer size up to 6" or to 8",Easy operation. This manual wafer bonder WB100 is our bonding solution designed for advanced semiconductor manufacturing. It offers micrometer-level precision for wafer-to substrate bonding applications,especially for GaN,SiC,Diamond,Ceramic,GaAs etc. With its innovative bonding capabilities, it ensures exceptional bond strength and good accuracy for your materials.

Easy Operation

Very compact and convenient.

High Precision

After bonding the wax layer thickness very uniform

Advanced Thermal Control

Temperature uniformity across wafer

Multi-bonding Technologies

Supports Airbag or Cushion Bonding

Technical Specifications

Wafer Size	150mm,large size 200mm and 300mm are customizable
Functions	timing, pressurization, heating(option),vacuum(option),cooling(option)
Bond Pressure	4~5bar (adjustable)
Temperature Range	Room Temp to 300°C
Throughput	Depends on the process
Chamber Environment	Vacuum(customizable)
Power Requirements	220V, 10A