High Precision Lapping and Polishing Equipments
HP81 is a desktop programmable Hot Plate, easy and convenient to operate. For wax coating and wafer bake.Wafer size up to 8". Touch Screen,lift pin is available. Max Temperature up to 150 ℃, 300 ℃. Programmable storage for up to 20 programs, each program can have 30 stages of step temperature values, with a maximum timing of 10 hours (600 minutes) for each stage. Suitable for chemical amplification glue, SU-8, PMMA, etc.Special baking requirements for high-precision, high stability, and step heating of special photoresist
Touch Screen.Heat Process programmable.
With lift pins,proximity baking is available.
Temperature uniformity across hotplate,Temperature uniformity: ± 2%
Programmable storage for up to 20 programs, each program can have 30 stages of step temperature values, with a maximum timing of 10 hours for each stage
| Wafer Size | Up to 200mm in diameter |
|---|---|
| Functions | Can add lift pin function to achieve timing,proximity baking,step heating |
| Applications | Heating and baking of chemical glue, SU-8, PMMA,special photoresist etc |
| Temperature Range | Room Temp to 150°C,300°C,different versions |
| Throughput | Depends on the process |
| Lid Protection | With lid for high stability and high precision step heating |
| Power Requirements | 220V, 10A |
Multi Stations,Semi-auto Wafer bonder for semiconductor wafer bonding
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