High Precision Lapping and Polishing Equipments
Bonding wax,solid and liquid wax,for temporary bonding, Specially designed for temporary fixation of semiconductor materials such as InSb,CZT,MCT,GaAs, InP, Si,SiC,Diamond,Ceramic etc. chemical corrosion resistance.
Solid wax,Liquid wax with different melting point and Viscosity
Wax layer less than 20um.
Low melting point,Medium melting point,High melting point,for different applications
Check the SDS for each type of waxes.
| Substrate needed | Glass,Sapphire,Silicon... |
|---|---|
| Related Product | Hotplate,Spin coater for liquid wax,and wafer bonder machine for no bubble bonding |
| Wax Layer thickness | after bonding wax layer less than 20um |
| Temperature | Can be used at high temperature. |
| Chemical resistant | Resistance to chemical corrosion |
| How to debond | Thermal sliding or using wax remover |
Multi Stations,Semi-auto Wafer bonder for semiconductor wafer bonding
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