Advanced Lapping and Polishing Solutions for Semiconductor Industry
Our advanced lapping and polishing solutions deliver unparalleled surface quality and dimensional accuracy for diamond wafers. With micron-level TTV precision control and industry-leading process stability, we help manufacturers achieve higher yields and superior product performance.
Lapple Technology's lapping and polishing solutions combine cutting-edge hardware with intelligent software control to deliver consistent, high-quality surface results. Our proprietary process algorithms optimize material removal rates while minimizing subsurface damage.
With near 20 years of industry experience, our solutions have been adopted by leading semiconductor manufacturers for applications ranging from silicon wafer and diamond wafers preparation to advanced packaging and MEMS fabrication.
Our diamond system features real-time thickness and temperature monitoring to maintain optimal performance throughout the production run, ensuring consistent results batch after batch.
Lapple Lapping Machine Demo Video，precision lapping process for silicon wafers
Achieve Surface TTV down to 3um within 4inch wafer and Ra down to 3nm or less with our advanced process control algorithms.
Our diamond processsing reducing processing time compared to conventional methods while maintaining superior surface quality and uniformity.
Intelligent process monitoring and adaptive control ensure consistent results with minimal operator intervention.
Complete lapping solution for ultra-thin and fragile wafer processing.
View Details
Contact our team to discuss how our precision lapping and polishing solutions can enhance your production quality and efficiency.
