Lapping & Polishing Machine - Suzhou Lapple Technology

Precision Lapping & Polishing Machine-Two Workstations

Model: LP062

The LP062 precision lapping and polishing machine is a two workstations desktop type, suitable for small-scale production of lapping and polishing. It can complete the processing of samples with a size of 6 inches or less, and the processed samples have characteristics such as high flatness and high surface finish. In the fields of semiconductor, optoelectronics, optics and other applications. All functions of LP062 lapping and polishing machine, including plate speed, swing arm setting, abrasive feeding are controllable, and these functions and parameters are all controlled and set through the touch screen.

Nanometer Precision

Achieves surface flatness down to 1μm and roughness Ra less than 1nm

Multi types of plates

Different plates to meet different applications

Advanced Plate Shape control

Efficient plate shape control to prevent bad TTV

High Flexibility

Can be used for lapping and polishing,for different size of samples,different applications on same system

Technical Specifications

Plate Size	400mm
Number of Workstation	2
Plate Surface Flatness	≤3μm
Final Sample Surface Roughness	Ra≤1nm,depending on process and materials
Sweep Arm	Driven jig roller arm with sweep,sweep speed and driven speed adjustable
Platen Speed	0~100rpm
Abrasive Feeding	Cylinder with two Peristaltic Pumps.
Power Requirements	220VAC, 10A
Dimensions and Weight	830×650×660mm (L×W×H),60KG