Suzhou Lapple Technology Co.,Ltd

Precision Chemical Polishing Machine

Model: CP043,Bromine-Methanol,For chemical polishing of GaAs,InP,MCT,CZT,Insb...

The Lapple CP043 is a corrosion-resistant chemical polishing machine featuring an integrated fume extraction enclosure. It is specifically engineered for aggressive and hazardous chemical polishing operations, such as Bromine-Methanol or acid etches, essential for prime face polishing of semiconductor wafers (including III-V materials like GaAs and InP) and electronic/optoelectronic crystals.

Key Features & Advantages:

Purpose-Built Design:

Precisely engineered for demanding chemical polishing applications.

Superior Results & Subsurface Integrity:

Utilizes a chemical etch polishing process to deliver high-precision surface finishes with minimal subsurface damage.

Enhanced Safety & Containment:

Integrated corrosion-resistant construction and fume extraction enclosure provide critical protection when handling aggressive and hazardous chemicals.

Comprehensive Process Control:

Offers full control over all critical functions including plate speed, timer, and slurry feeding.

Intuitive Operation:

All functions and parameters are conveniently set and controlled via a user-friendly touch screen interface.

Technical Specifications

Plate Size	400mm
Number of Workstation	3
Slurry Feeding Channel	4 of bottles and 4 of peristaltic pumps
Final Sample Surface Roughness	Ra≤10nm,depending on process and materials
Sample Driven function	Three Eccentric Gears driven by the plate
Platen Speed	0~100rpm
Max substrate size	112mm, big size can be customized.
Power Requirements	220VAC, 10A
Dimensions and Weight	2000×1560×2000mm (L×W×H),550KG

*Due to the continuous development of the product, there may be changes in the relevant parameters

Download Brochure & Specifications