High Precision Lapping and Polishing Equipments
The CMP061 is a precision CMP machine for wafer and chip,it's floor type, suitable for CMP research applications. It can complete the CMP processing of samples with a size of 6 inches or less, and the processed samples have characteristics such as good surface uniformity and high surface finish. In the fields of semiconductor, optoelectronics, optics and other applications. All functions of 1CMP061 CMP machine, including plate speed,head speed,pressure, sweep setting, slurry feeding are controllable, and these functions and parameters are all controlled and set through the touch screen.
Achieves excellent surface uniformity,Roughness Ra less than 1nm
Different pads and slurries to meet different CMP applications
Efficient Wafer shape control to prevent bad surface uniformity
Twin heads,memrane head or template head,wafers or chips.
| Plate Size | 500mm |
|---|---|
| Number of Workstation | 2 |
| Head Pressure Zone | 2~3 |
| Plate Surface Flatness | ≤4μm |
| Final Sample Surface | WIWNU,WTWNU <= 8%,Ra≤1nm,depending on process and materials |
| Sweep Head | Two heads runs with sweep function,sweep speed and amplitude adjustable |
| Platen/Head Speed | 0~200rpm |
| Slurry Feeding | Four slurry channels with four Peristaltic Pumps. |
| Power Requirements | 220VAC, 10A |
| Dimensions and Weight | 1060×1610×2000mm (L×W×H),800KG |
Comprehensive polishing pad for CMP polishing applications
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Comprehensive polishing slurries for Silicon,SiO2,SiNx,Copper,GaN,SiC,LiNO3,etc.
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