High Precision Lapping and Polishing Equipments
The CN081 is a single wafer system provides post grinding/lapping, post polishing, bevel clean and other chemical wet processes for substrate surfaces in semiconductor manufacturing, and all functions and parameters are all controlled and set through the touch screen.This system can do efficient particle removal and it's the best choice for your materials.
Due to modular design,easy configuration and flexible upgrading.
Maxium safety for operators,fab and enviroment according to highest safety standards
Optimized fab footprint and easy feed
No expensive space for chemicals management system in the clean room.
| Wafer Size | Up to 8"(200mm),12" can be customized |
|---|---|
| Number of Workstation | 1 |
| Wafer Materials | Si,SiC,GaAs,GaN,Glass,Quartz,Sapphire,etc. |
| Substrates | Wafers,MEMS,Optoelectronics,Photomasks,up to 8" and square substrates. |
| Processes | Post Grinding/Lapping/Polishing,Post CMP,Backside,Reclaim,Bevel clean,TSV cleaning |
| Benefits | Low chemical and water consumption |
| Power Requirements | 220VAC, 10A |
Comprehensive polishing pad for CMP polishing applications
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Comprehensive polishing slurries for Silicon,SiO2,SiNx,Copper,GaN,SiC,LiNO3,etc.
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