Lapping & Polishing Machine - Suzhou Lapple Technology

Driving Ring for Precision Lapping and Polishing

Series:Different materials,for different sample and jigs.

Precision surface preparation is paramount in semiconductor manufacturing. Our specialized Lapple lapping and polishing driving ring are engineered to meet the extreme demands of processing semiconductor wafers (Silicon, SiC, GaAs, GaN, InP, Sapphire,MCT,CZT,InSb....) and critical components. They provide the essential foundation for achieving ultra-flat, damage-free surfaces with nanometer-level precision required for subsequent lithography, deposition, and inspection stages. Selection of the optimal plate material and groove pattern is critical based on the substrate material, wafer size (e.g., 150mm, 200mm), process stage (rough lapping, fine lapping, polishing), and desired surface finish.

Ultra-High Precision Flatness:

Manufactured to micron flatness specifications. Essential for achieving uniform material removal.

Optimized Groove Patterns:

Grooves are critical for slurry distribution, debris removal, heat dissipation, and pressure control.

Superior Surface Finish & Damage Control

Engineered to minimize subsurface damage, micro-cracks, and scratches during material removal, preserving wafer integrity and device yield.

Extended Jig Lifespan & Consistency

High-quality materials and precision manufacturing ensure long service life and consistent performance batch-to-batch, reducing consumable costs and process variability.