Lapping & Polishing Machine - Suzhou Lapple Technology

Abrasive Cylinder

Series:For abrasive feeding,for lapping and polishing machines.

Lapple's specialized abrasive supply cylinders deliver critical precision in semiconductor surface preparation. Engineered to feed a constant, stable flow of abrasive slurry to lapping and polishing plates, these systems directly optimize process outcomes by minimizing defects.

Our range includes:Cylinder with valve only,Cylinder for peristaltic pump,Cylinder with mixer.

Stable & Controlled Flow

Ensures consistent abrasive delivery for uniform material removal and surface finish.

Contamination Prevention

Maintains slurry purity critical for defect-sensitive semiconductor processes.

Anti-Agglomeration

Prevents particle settling, clumping, or agglomeration, eliminating flow interruptions and potential surface scratches.

Process Reliability

Reduces variability and safeguards against scratches, pits, and other surface damage.

Abrasive Cylinders

Materials Involved	PVC	Peek	PVDF	Special material can be customized.
Typical Size	Diameter: 150~200mm	Length: 200~400mm	Vol: 1.5L~4L	Special sizes can be customized.