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Lapping&Polishing-LP062

Two Stations，Max 6"

Lapping&Polishing-LP061

One Station，Max 6"

Four Stations System

For Production，4"~6"

Vacuum Bonder

Vacuum and diaphgram press,temporary bonding

Recommended Product

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Advanced Products

Scriber S100

Semi- Post CMP Cleaner

Lapping&Polishing-LP061

Lapping&Polishing-LP064

Semi LD Bar Stacker

Auto LD Bar Stacker

Manual Scriber

Lapping&Polishing-LP062

CMP

Solution

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Leading one-stop process solution

Precision Lapping &Polishing

For wafer lapping and polishing,TTV,Flatness,Roughness control etc,

Ultra thin wafer

Fragile materials such as InP, GaAs, etc., when it is thinned and polished to a thickness of about 100 microns or less, it can be difficult to remove, transfer, clean, etc.

End Face Lapping&Polishing

Precision lapping& polishing of chips, crystals and fiber optic end faces, angled end faces such as flat/8-degree/10 degree/15 degree angles.

Temporary bonding and debonding

Temporary bonding of wafers and substrates, solution for removing wafers after lapping and polishing

LD bar stacker

Semi and auto stacker for LD bar。

Lapping&Polishing

Ultra thin wafer process

Endface lapping&polishing

Temporary bonding and debonding

LD bar Stacker

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