High Precision Lapping and Polishing Equipments
The system CG10 and NCG10 are suitable for most linear dimensional measurement applications, offering a high degree of accuracy over a wide measuring range with low gauging forces. All measurements are displayed on the digital read-out.Reliable and durable,easy to operate. CG10 is a contact thickness measurement system,NCG10 is a non-contact thickness measurement.
Simple and very easy to operate
Thickness reading very stable and constant
Easy to use standard blocks to calibrate the system.
Wide measuring range with low gauging forces
| Wafer Size | 6"(150mm),8" version can be customized. |
|---|---|
| Number of Workstation | 1 |
| Measurement Reading Precision | 1um |
| Power Requirements | 220VAC 10A |
Precision bonding solution for advanced semiconductor manufacturing
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For load measurement of precision lapping and polishing jigs
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