Multi Stations Wafer Bonder

Desktop semi-automatic bonding machine, easy and convenient to operate. It can perform semi-automatic wafer bonding operation.Wafer size up to 6" or to 8"。

Multi Stations Wafer Bonder can perform multiple wafers bonding simultaneously。

Multiple processes are available. It has functions such as timing, vacuuming, diaphgram pressurization, heating, etc.

Easy operation。

For more details please contact our sales。