Manual WB100

WB100 is a desktop manual bonding machine, easy and convenient to operate,using air cylinder for bonding. Wafer size up to 6" or to 8"。

WB100 is very compact and convenient. It has functions such as timing, pressurization, heating, etc.

For wafer temporay bonding。Wafer size up to 6" or to 8",Easy operation。

For more details please contact our sales。