LP061 High Precision Lapping and Polishing Machine

LP061 is a desktop compact system for high-precision lapping and polishing of wafers. Plate diameter is 400mm.

LP061 is a desktop compact system for high-precision lapping and polishing of wafers.

Plate diameter:400mm.For 4" and 6" wafers.

Single station,plate speed up to 100rpm.

For more details please contact our sales。