LP062 High Precision Lapping and Polishing Machine

LP062 is a desktop compact system for high-precision lapping and polishing of wafers. With 2 stations,for small scale production.

LP062 is a desktop compact system for high-precision lapping and polishing of wafers. With 2 stations,for small scale production.

Plate diameter:400mm.For 4" and 6" wafers lapping and polishing.

Two peristaltic pumps,slurry feeding rate 1-100ml/min;Plate speed up to 100rpm.

For more details please contact our sales。