WB061 Single Head Wafer Bonder

Desktop semi-automatic bonding machine, easy and convenient to operate. It can perform semi-automatic wafer bonding operation.Wafer size up to 6" 。

WB061 Wafer Bonder can perform one 6" wafer bonding to a substrate or carrier。

Multiple processes are available. It has functions such as timing, vacuuming, diaphgram pressurization, heating,cooling etc.

Max Temperature up to 200degree,and pressure 0~3bar.

For more details please contact our sales。