About us
Lapple (Shanghai) Technology Co., Ltd. is a professional provider of technology solutions for the semiconductor industry. Solutions include: temporary wafer adhesive sheet to take tablets, wafer / end surface precision polishing, wafer dicing lobes, LD bar strip stacker, ultra-thin delicate wafer processing.
As a professional provider, we offer our customers the world's most advanced level and the highest quality equipment, supplies, and technology services in related applications.
We have our own laboratories, factories and technical personnel, we can engage in demonstration equipment, precision grinding and polishing process development, equipment design and manufacturing as well as grinding, polishing and processing services.
Our products and technologies are widely used in optoelectronics, semiconductors, precision ceramics, precision optics and other industries.
We are committed to become a dedicated, humane, and growth-oriented technology companies, our dynamic and efficient team of professionals in all aspects to provide customers with professional and meticulous service.